Flip Chip — All You Need to Know
Flip Chip — All You Need to Know
Flip chip technology has revolutionized how we think about integrated circuits and semiconductor components over the past several decades. The advanced manufacturing and rework process has paved the way for the creation of intricate devices that perform better than the previous modules. The innovation application potential is enormous. Flip chip has multiple benefits. They reduce signal and ground inductance, lower package footprint and higher signal density.
What Is a Flip Chip?
Flip chip technology is an advanced process of electronically connecting dies, such as semiconductor devices, integrated circuits or monolithic integrated circuits, integrated passive devices and microelectromechanical systems (MEMS) to package carriers. The package carrier, which could either be a lead frame or substrate, connects the die to the package's exterior.
A flip chip BGA is a ball grid array type that uses a flip-chip or controlled collapse chip connection. It works through solder bumps on the top of the chip pads. The process starts with integrated circuits on the wafer. Pads are metalized on the chips, and solder balls are placed on each pad. The chips are cut and then flipped so the solder balls are positioned facing the external circuitry. The solder is then reflowed to create an interconnection.
Common Flip Chip Packages
There are multiple package-level solutions, depending on the specific die and application requirements, with each offering unique benefits. Here are the three common examples:
1. Flip Chip BGA (FCBGA)
FCBGA packages are typically ceramic substrate or organic layer laminate. They can also come in a bare die, flat lid or full lid configuration. They may be assembled on a two-metal layer or a multi-layered substrate or laminate.
Ceramic substrates have better moisture resistance, higher thermal conductivity and electrical insulating property than organic layer laminates, while laminate substrates offer enhanced electrical performance than wire-bond BFA packages, especially in high-frequency applications. FCBGA packages have broad applications. They are used in consumer electronic products, such as the following:
- Game console
- Graphics and chipsets for PCs
- Servers
- Microprocessor for PC and servers
- Memory
They also have a wide application in telecommunication, including the following:
- Network products (LAN)
- Transmission
- Switching
- Cellular base stations
2. Flip Chip Chip Scale Package (FCCSP)
FCCSPs are upturned and connected to the board through a bump instead of wire bonding. This provides better protection for the chip and better solder joint reliability than the chip on board (COB), and direct ship attach (DCA). They are designed for high-frequency applications with thin-core ceramic or laminate package construction. Compared to a known good die (KGD), FCCSP is superior in low-cost testing and burn-in and performs a similar electrical function to KGD.
Their application includes the following:
- Cell phones
- Handheld electronics
- GPS
- PC peripherals
- Voltage regulators
- High-speed memory
- Camcorders
- DVD
- Digital cameras
3. Flip Chip System in Package (SiP)
SiP realizes complex functions into one system by mounting multiple passive components and ICs in a package. It has stable product performance and heat dissipation characteristics and is used in several applications, including the following:
- Power amplifiers (PA)
- Front-end module with an integrated duplexer (FEMID)
- Power amplifier module with an integrated duplexer (PAMID)
- Bulk acoustic wave (BAW) filter
- Surface acoustic wave (SAW) filter
- RF parts like diversity FEM and switch
Why Use a Flip Chip BGA?
1. Performance and Reliability
Flip chip is useful for high-frequency applications since it rests directly on the circuit board. The size is relatively small, resulting in less inductance and enhanced signal speed. They have better thermal conductivity and moisture resistance. This process is usually preferred over standard wire bonding BGA packages. Flip chip components are mostly used in semiconductor operations. However, other components, like detector arrays and passive filters, can also use the flip chip design.
2. Reduced Package Footprint
Using a flip chip can reduce the total package size by utilizing higher-density substrate technology, which allows for reduced package pitch or decreases the die-to-package edge requirements since additional space is not required for wires.
3. Cost Saving
A flip chip is less complex and more affordable than traditional assembly processes. This improves production times and reduces the bill of materials, ultimately leading to enhanced time-to-market and lower costs.
4. Simpler Integration
Flip chips connect easily with existing systems. They also align with new products, making integrating them into existing systems easier with minimal disruptions.
Challenges with Flip Chip BGA
Although flip chip BGAs are high-performance arrays at a reasonable cost, they are not suitable for all situations. You will need to be sure you have a consistently flat mounting surface to use a flip chip. You will also need to account for thermal expansion, as the connections created by the flip chip are rigid and vulnerable to cracking. They can also be somewhat complicated to replace. If these issues do not present serious obstacles to you in your BGA applications, you can derive great benefits from a flip-chip design.
Contact Precision PCB Services for Help With Your Flip Chip BGA
Flip chip technology has multiple applications within the consumer electronics, automotive, telecommunication and aerospace industries, with various package options offering unique benefits. It is resistant, high-performing and often a more affordable alternative. Flip chips are also easier to integrate with existing systems and can reduce package size.
Precision PCB Services is well-known for the quality of our products and the scope of our customer service. We have BGA rework stations for all types of BGA packages, including various flip chip packages. If your flip chip BGA is in need of repair or rework, we have the products to help.
Partnering with Precision PCB Services gives you access to a dedicated professional to assist you with your technical support and needs. Contact us now to learn more about how we can help you with your flip chip BGA or any of your BGA packages.