Ceramic Package Reballing
Precision PCB Services provides state-of-the-art ceramic reballing services for clients across a variety of industries. For over 25 years, our dedicated team at Precision PCB Services has been providing circuit board electronic assembly support, rework services and repair services for product researchers, contract manufacturers and many other professionals.
We offer a variety of rework and repair services along with training programs and consultations. We're committed to exceeding your expectations with every service we offer, including reballing for ceramics. When you need solder ball reworking or replacement, you can trust the experts at Precision PCB Services to get the job done with speed and efficiency.
Package Types We Work On
Precision PCB Services works on multiple package types for ceramic reballing. Ceramic reballing refers to the process of removing solder balls, often defective, from a circuit and replacing them with new ones. At Precision PCB Services, we specialize in common types of ceramic reballing for ball grid array (BGA) surfaces.
If you need top-quality ceramic reballing services for BGA component reworks, we can work with the following package types:
CCGA
We work on ceramic column grid array (CCGA) packages. These packages are constructed with non-collapsible solder columns and are typically used for mount soldering. CCGA packages are used on print circuit boards (PCBs) and feature large ceramic substrates. Precision PCB has the capability to perform cutting-edge ceramic reballing services for CCGA packages when you need reworking or modification services.
CBGA
Precision PCB Services can perform rework services for ceramic ball grid array (CBGA) packages as well. The CBGA package is a ceramic package that contains solder balls used for external electric connection — an alternative to traditional leads. A single CBGA can have anywhere from nine to over 300 solder balls, which are set at the bottom of the package body. Precision PCB Services offers high-quality reballing services for CBGA packages of any size.
CPGA
We also offer ceramic pin grid array (CPGA) package services for reballing and rework projects. CPGAs feature a through-hole ceramic package with leads or pins positioned in a square array at the package's bottom. CPGA packages can also feature solder-sealed metal lids or frit-sealed ceramic lids. At Precision PCB Services, we provide high-tech, efficient CPGA package reballing services.
Reballing Ceramic Process
The ceramic reballing process involves multiple carefully conducted steps. These steps include:
- Preparing the BGA surfaces by clearing their components and cleaning the surface
- Securing the units with a specially designed mold
- Introducing and securing the stencils
- Shaking the solder balls into place on the surface
- Performing reflow soldering and cleaning any flux left over
- Performing a final inspection and verification
For more information about our reballing process for ceramic grid arrays, talk to one of our experts today!
Why Precision PCB Resources?
Since the early '90s, Precision PCB Services has been providing cutting-edge products and services for clients looking for assembly, repair and additional advanced services for printed circuit boards and other components. See what Precision PCB's reballing service can do for you and request a free quote!