PoP Rework and Repair Services

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As board densities become greater on handheld consumer devices, more board designers rely on the Z dimension to achieve greater design flexibility and functionality in less space. Designers use Package on Package (PoP) construction in which ball grid array (BGA) area devices are placed one on top of the next.

With this construction, the memory and CPU are joined together, and in some cases a third layer co-processor is also included. PoP construction typically has a high IO count and are very thin and fine pitch.

Benefits of PoP Rework and Repair Services

PoP rework can be challenging. Because these packages are so thin, they are prone to warping under thermal stress, particularly in the reflow cycle. They can also be difficult to inspect due to their stacked nature. Often, these types of packages are also underfilled. When you remove the device closest to the component being reworked, there is a greater likelihood of damage.

At Precision PCB Services, we have a variety of techniques and equipment to tackle these challenges. Our tools are fully capable of diagnosing and troubleshooting unique PoP issues, then quickly performing a repair and rebuild.

In addition to the right equipment, we have access to the materials needed for PoP rework. For example, solder paste dipping is used to ensure consistent deposit volume in order to widen the process window. This helps make it easier to clean any flux residue. We have experience with numerous different fluxes to make the rework process consistent.

Why Choose Precision PCB Services?

At Precision PCB Services, we offer a variety of PCB rework and active-PCB solutions. We offer a complete line of high-tech services on the cutting edge of new technology to help product developers, researchers and manufacturers. For over 25 years, we have provided services, products, consulting and training for the repair, rework and assembly of electronic assemblies and printed circuit boards.

Our soldering training and certification courses are taught with IPC guidelines, and we can set up custom courses for your specific requests. Additional courses we offer include:

  • Ball grid array
  • Surface mount
  • Solder and rework training
  • Component rework skills
  • Through hole hand solder training

We are a leader in Profile Development, BGA Component Research and Lead-Free Process. We also have a complete line of high-end Split Vision BGA Rework Stations at a budget-friendly price. These rework stations are essential for printed circuit board modification and repair.

Let us do the work for you and install or exchange your BGA components. Our services are performed automatically with the latest rework equipment. We can also reball PoP packages as well as numerous other packages including QFN, Chip Scale, LGA and more.

Contact Us Today to Get Started

Precision PCB Services can help you successfully navigate the challenges of PoP rework as well as other BGA rework and repair. For more information, give us a call or submit our online form to get in touch with us.