Shuttle Star RW-SV2000A BGA Rework Station

Shuttle Star RW-SV2000A BGA Rework Station Features:

  • Heater head and mounter head are designed 2 in 1, with auto-align, auto-placement, auto-solder and auto-desolder function, position storage up to 50K.
  • X/Y axis driven by motor, controlled by joystick, able to micro-adjust when getting close to target position, with position record function. 
  • Color optical system with functions of split vision, zoom - in and micro-adjustment, equipped with aberration  detection device; with auto focus and software operation function,30X optical focus; able to rework BGA sized up to 80mm*80mm;
  • Touch screen interface, PLC control; able to display set temperature curves and five detecting temperature curves at the same time; Profile analysis can be carried out on the touch screen;
  • Color LCD monitor, suction nozzle can identify component and mounting height, max. vacuum suction up to 80g.
  • Able to use Nitrogen,  finished the BGA rework process under the nitrogen protection, with air/Nitrogen source pressure-miss protection function.
  • Built in vacuum pump; max. vacuum suction up to 80g,which can be micro-adjusted. Suction nozzle can be rotated in 360°;
  • PCB support holder can be micro-adjusted to avoid partial sink in soldering area. 
  • 8 segments of temperature up (down) and 8 segments constant temperature control, more than 50000 groups of  profile can be stored.; Profile analysis can be carried out on the touch screen; able to connect to PC, with PC communication function. 
  • Three independent heating systems, temperature and time can be displayed digitally on the touch screen, able to repair difficultly-reworked CGA, both top and bottom heater head are movable. 
  • Suitable for large Servo, Base station, Industrial computer repair, able to rework difficult components like CGA, BGA, QFN, CSP, LGA, Micro SMD, MLF (Micro Lead Frames)

 

Applicable PCB Max. PCB size 1000X800mm = 39"X 31.5"
Workable area 800X1000mm
Bottom preheat area 700*600mm = 27.5"X23.5"
PCB thickness 0.5-5mm (Max. thickness 10mm with custom-made jig)
Applicable BGA Max. size 80mm x 80mm
Min. size 1mm x 1mm
Max. weight 80g
Placement accuracy ±0.05mm
Temperature control Upper heater 350°C
Lower heater 350°C
Bottom IR heater 300°C
Control model 16 zones of programmable temperature setting for profile.
Power consumption System total power Max. 24KW/65Amp @ 3 Phase
Upper heater Max. 2000W
Lower heater Max. 2000W
Bottom IR heater Max. 18000W
System parameter Machine Dimension L2120*W1520*H1700mm
Machine Weight Appox 700KGS = 1534 LBS.
Input voltage Three-phase 380V±10% 50/60Hz 24KW / 65 Amp
Air or Nitrogen source 4~6kgf/cm2 95L/min

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